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Heavy-Wire Bond Arrangement Technische Universität Berlin (Zentrum für geistiges Eigentum)

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Background

In the field of heavy-wire bonding (wires with diameters of between approximately 100μm and approximately 500μm), the different thermal expansion coefficients of the materials involved, i.e. in particular of the semiconductor and the heavy wire, lead to fatigue cracks forming in the contacting plane of the heavy-wire bond connections. Therefore, there exists a need for technologies for preventing such problems in heavy-wire bond connections.

 

Technical Description

The invention comprises a heavywire bond arrangement with a substrate, a heavy wire and a  highvoltage heavy-wire bond connection, in which an end bond section of the heavy wire, which extends towards the end of the heavy wire, is bonded to the substrate, such that in the area of the bond section a bond contact between the heavy wire and the substrate is formed, the heavy wire  having a tapering section which adjoins the end of the wire and in which the wire cross-section tapers towards the end of the wire. The provision of the tapering section, which extends in the bond section of the heavy wire as far as the end of the wire, reduces the effective shear stress in the area of the bond section, resulting in an improved reliability of the bond connection between heavy wire and substrate. Moreover, the likelihood of reduced fatigue cracks is reduced and the current-carrying capacity is maintained in the area of the bond section.

 

First Results

It could be proven that tapering the end of the wire reduces the stress within the interface as well as the accumulated distention and tensions within the tail- and heel area.

 

Benefits

  • Reducing shear stress due to thermal extension

  • Current bonding methods can still be used

  • Avoid fatigue cracks

  • Consistently good bonding can be ensured

 

Development Stage

Prototype

 

IP Rights

DE patent granted, EP and

US application pending,

Priority October 2010

Patent Owner

Technische Universität Berlin

 

Chances for cooperation

  • Licensing

  • Patent Sale

  • R&D cooperation

Art der Kooperation:
Kooperation in Forschungsprojekten
Patentverwertung

Kontakt

Technische Universität Berlin (Zentrum für geistiges Eigentum) Jeanne Trommer

Dokumente zum Download

Technische Universität Berlin (Zentrum für geistiges Eigentum)

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Contact Jeanne Trommer Phone: +49 (0)30 314-24472 - Licensing Manager - Fax:+49 (0)30 314-28621 www.tu-berlin.de Fraunhoferstr. 33-36 jeanne.trommer@tu-berlin.de 10587 Berlin ...

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Contact Jeanne Trommer Phone: +49 (0)30 314-24472 - Licensing Manager - Fax:+49 (0)30 314-28621 www.tu-berlin.de Fraunhoferstr. 33-36 jeanne.trommer@tu-berlin.de 10587 Berlin ...